●Surface treatment: hot air leveling, die punching, digital V-cutting, milling machine molding spraying lead tin, spraying environmentally friendly tin/lead-free tin, nickel plating, electro-gold/chemical immersion gold/chemical gold, rosin, carbon bridge/carbon finger , Carbon perforation
●Production layers: single-sided, double-sided
●Maximum processing area: single side: 600MM×450MM; double side: 580MM×580MM;
●Board thickness: the thickest: 0.8MM; the thickest: 2.0MM
●Metalized hole diameter tolerance: Pth Hole Dia.Tolerance≤diameter 0.8±0.05MM>diameter 0.8±0.10MM
●Position difference: ±0.05MM
●Electric strength and peeling strength: Electric strength: ≥1.6Kv/mm; Peeling strength: 1.5v/mm
●Solder resist hardness:>5H
●Heat shock: 288℃ 10SES
●Combustion rating: 94V0 fire rating
●Solderability: 235℃
●Substrate copper foil thickness: 1/2OZ, 1/1OZ, H/HOZ, 1OZ, 2OZ, 3OZ
●Plating layer thickness: nickel thickness 5-30UM gold thickness 0.015-0.75UM
●Reliability test: open/short circuit test
●Solder mask colors: green, black, blue, white, red, yellow.
●Character color: white, black, etc. ● V cut: Angle: 30 degrees, 35 degrees, 45 degrees Depth: board thickness 2/3
●Common substrate: ordinary cardboard: 94HB (normal cardboard, not fireproof), 94V0 (flame retardant cardboard, fireproof), FR-1 (fireproof), FR-2 (fireproof), fireproof glass fiber board: 22F (semi-glass fiber ), CEM-1 (half glass fiber), CEM-3 (double-sided half glass fiber), FR-4 (full glass spool), aluminum substrate, high frequency board